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TSP 2018 - EXTENDED DEADLINE: March 13 (8 extra days) | Athens, Greece, July 4-6, 2018 | 41st Int. Conference on Telecommunications and Signal Processing - IEEE Xplore® - SCOPUS - Thomson Reuters ISI Proceedings - DBLP - Google Scholar

*2018 41st International Conference on Telecommunications and Signal 
Processing (TSP)
*July 4-6, 2018, Athens, Greece
Web: http://tsp.vutbr.cz/

*Full Paper Submission*: March 13, 2018 (/extended deadline/)

Technically co-sponsored by *IEEE Region 8 (Europe, Middle East and 
Africa)*, *IEEE Greece Section*, *IEEE Czechoslovakia Section*, and 
*IEEE Czechoslovakia Section SP/CAS/COM Joint Chapter*.

The TSP 2018 Proceedings, containing presented papers at the Conference, 
will be submitted for indexing to the *IEEE Xplore® Digital Library* 
registered under /_IEEE Conference Record #43564_/, *SCOPUS*, 
*Conference Proceedings Citation Index (CPCI) of Thomson Reuters*, 
*DBLP*, and *Google Scholar databases*.

Authors of the best rated and presented papers will be invited for 
publishing in special issues of international journals.

Dear Colleague,

You are kindly invited to participate in the *2018 41st International 
Conference on Telecommunications and Signal Processing (TSP* - 
http://tsp.vutbr.cz/), which will be held on *July 4-6, 2018, inAthens, 

The TSP Conference serves as a premier annual international forum to 
promote the exchange of the latest advances in telecommunication 
technology and signal processing. The aim of the Conference is to bring 
together both novice and experienced scientists, developers, and 
specialists, to meet new colleagues, collect new ideas, and establish 
new cooperation between research groups from universities, research 
centers, and private sectors from the whole Europe, America, Asia, 
Australia, and Africa.

We are glad to announce the following Keynote Speakers:

- _Prof. Ozgur B. Akan, IEEE Fellow_ â?? Head of the Internet of 
Everything Group at the Department of Engineering, University of 
Cambridge, UK
... /Title: Internet of Everything â?? From Molecules to the Universe
- _Prof. Themis Prodromakis_ â?? Professor of Nanotechnology and Head of 
the Electronic Materials and Devices Research Group in the Zepler 
Institute, University of Southampton, UK
... /Title: Memristor-based Neuromorphic Computing Systems
TSP 2018 has opened *Call for Papers for Full Paper Submissions* with an 
/EXTENDED deadline set for March 13, 2018 (8 extra days)/. We look 
forward to your innovative contributions in any of the following areas:

/AREA 1: Telecommunications
1. Information Systems
2. Network Services
3. Network Technologies
4. Telecommunication Systems
5. Modelling, Simulation and Measurement

/AREA 2: Signal Processing
6. Analog Signal Processing
7. Audio, Speech and Language Processing
8. Biomedical Signal Processing
9. Digital Signal Processing
10. Image and Video Signal Processing

For more details please visit the Conference website at 
http://tsp.vutbr.cz/?page_id=121 .

The following Workshops and Special Sessions will be organized during 
the Conference:

- WS1: 2nd International Workshop on Recent Advances in Biometrics and 
its Applications organized by Assoc. Prof. Larbi Boubchir & Prof. 
Boubaker Daachi (both LIASD - University of Paris 8, France)
- WS2: 8th SPLab Workshop of Signal Processing Laboratory organized by 
Prof. Zdenek Smekal, Assoc. Prof. Radim Burget, Dr. Jiri Mekyska, Assoc. 
Prof. Pavel Rajmic, Assoc. Prof. Kamil Riha, Assoc. Prof. Jiri Schimmel 
(all Brno University of Technology, Czech Republic)
- SS1: Special Session on Signal Processing Techniques for Ground 
Penetrating Radar Applications (SPT4GPRA) organized by Prof. Dr. 
Francesco Benedetto, PhD (University of Roma Tre, Rome, Italy) and Dr. 
Fabio Tosti, PhD (University of West London (UWL), London, UK)
- SS2: Special Session on Monitoring and Control Based on Image 
Processing organized by Prof.dr.ing. Dan Popescu and Dr. Loretta Ichim 
(both from the University POLITEHNICA of Bucharest, Romania)
- SS3: Special Session on Photonic Networks and their Applications 
(Theory, Design, Modeling, Trials) organized by Dr. Josef Vojtech 
(CESNET a.l.e., Czech Republic) and Dr. Petr Munster (Brno University of 
Technology, Czech Republic)
- SS4: Special Session on Multivariate Data Analysis and Knowledge 
Discovery â?? From Theory to Applications will be organized by Prof. 
Corneliu Burileanu and Dr. Anamaria Radoi (both with the University 
Politehnica of Bucharest, Romania)
- SS5: Special Session on Robust Face and Emotion Recognition and 
Analysis will be organized by Ing. Dr. HDR. Hassene seddik â?? ENSIT, 
Tunisia, Dr. Zied Lachiri â?? ENIT, Tunisia, and Assoc. Prof. Nawres 
Khlifa â?? ISTMT, Tunisia

Prospective Organizers are invited to submit LATE proposals for 
Workshops and Special Sessions held during the TSP 2018 Conference. 
Organizing guidelines are available at http://tsp.vutbr.cz/?page_id=3492 .

In cooperation with IEEE Czechoslovakia Section SP/CAS/COM Joint 
Chapter, to recognize outstanding technical contributions by students, 
as evidenced by the quality of papers, their presentations, and their 
technical excellence, the authors of the Best 3 Student Papers will be 
awarded during the conference by the Technical Committee. The Best 
Student Paper Award consists in a Certificate of Appreciation Plaque and 
an IEEE Student or IEEE Graduate Student membership for 2019.

The TSP 2018 is IEEE technically co-sponsored Conference organized in 
cooperation with seventeen universities:

- Brno University of Technology, Department of Telecommunications, Brno, 
Czech Republic
- Budapest University of Technology and Economics, Department of 
Telecommunications and Media Informatics, Budapest, Hungary
- Czech Technical University in Prague, Department of Telecommunication 
Engineering, Prague, Czech Republic
- Isik University, Department of Electrical and Electronics Engineering, 
Sile/Istanbul, Turkey
- Istanbul Technical University, Electronics and Communication 
Engineering Department, Istanbul, Turkey
- Karadeniz Technical University, Department of Electrical and 
Electronics Engineering, Trabzon, Turkey
- National Taiwan University of Science and Technology, Department of 
Electronic and Computer Engineering, Taipei, Taiwan
- Seikei University, Graduate School and Faculty of Science and 
Technology, Information Networking Laboratory, Tokyo, Japan
- Slovak University of Technology, Institute of Telecommunications, 
Bratislava, Slovak Republic
- Tecnocampus, Escola Universitaria Politecnica de Mataro, Mataro, Spain
- Technical University of Sofia, Faculty of Telecommunications, Sofia, 
- Universite Paris 8, UFR MITSIC, Laboratoire d'Informatique Avancee de 
Saint-Denis (LIASD), France
- University of Ljubljana, Laboratory for Telecommunications, Ljubljana, 
- University of Osijek, Faculty of Electrical Engineering, Computer 
Science and Information Technology Osijek, Osijek, Croatia
- University of Patras, Physics Department, Patras, Greece
- VSB - Technical University of Ostrava, Department of 
Telecommunications, Ostrava, Czech Republic
- West Pomeranian University of Technology, Faculty of Electrical 
Engineering, Szczecin, Poland

- Miloslav Filka, Brno University of Technology, Czech Republic - Full 
Professor, TSP Conference Founder - Honorary Chair
- Norbert Herencsar, Brno University of Technology, Czech Republic - 
IEEE Czechoslovakia Section CAS/COM/SP Joint Chapter Chair, IEEE Senior 
Member - General Co-Chair
- Costas Psychalinos, University of Patras, Greece - Full Professor, 
IEEE Senior Member
- Jaroslav Koton, Brno University of Technology, Czech Republic, IEEE 
Senior Member - Publications Chair
- Jiri Hosek, Brno University of Technology, Czech Republic, IEEE Member 
- Student Paper Contest Chair
- Aslihan Kartci, Brno University of Technology, Czech Republic - 
Publicity & Social Media Chair
- Nandor Matrai, Asszisztencia Congress Bureau, Hungary - Managing 
Director - Finance Chair
- Csilla Fulop, Asszisztencia Congress Bureau, Hungary - Project Manager 
- Registrations Chair

/Steering Committee:
- Larbi Boubchir, Universite Paris 8, France - Associate Professor, IEEE 
Senior Member
- Marcos Faundez-Zanuy, Escola Universitaria Politecnica de Mataro, 
Tecnocampus, Spain - Dean
- Izzet Cem Goknar, Isik University, Turkey - Institute of Science 
Director & Circuits and Systems (CAS) Society Turkey Chapter Chair, IEEE 
Life Fellow
- Ray-Guang Cheng, National Taiwan University of Science and Technology 
(NTUST), Taiwan - Full Professor, IEEE Senior Member
- Ismail Kaya, Karadeniz Technical University, Turkey
- Sridhar Krishnan, Ryerson University, Canada - Associate Dean, IEEE 
Senior Member
- Mario Kusek, University of Zagreb, Croatia, IEEE Member - IEEE Croatia 
Section Communications Chapter Chair
- Antonio Luque, University of Seville, Spain - IEEE Region 8 Vice Chair 
Member Activities 2017, IEEE Spain Section Chair 2016-2017, IEEE Senior 
- Shahram Minaei, Dogus University, Turkey - Full Professor, IEEE Senior 
- Ram M. Narayanan, The Pennsylvania State University, USA - Full 
Professor, IEEE Fellow
- Kimio Oguchi, Seikei University, Japan - Full Professor, IEEE Senior 
- Serdar Ozoguz, Istanbul Technical University, Turkey - Full Professor, 
Associate Chair
- Jakub Peksinski, West Pomeranian University of Technology, Poland
- Hector Perez-Meana, National Polytechnic Institute, Mexico - Full 
Professor, IEEE Senior Member
- Vladimir Poulkov, Technical University of Sofia, Bulgaria - Dean, IEEE 
Senior Member
- Markus Rupp, Vienna University of Technology, Austria - Dean, IEEE Fellow
- Zdenek Smekal, Brno University of Technology, Czech Republic - Full 
Professor, IEEE Senior Member
- Attila Vidacs, Budapest University of Technology and Economics, 
Hungary - Deputy Head of Department
- Miroslav Voznak, VSB-Technical University of Ostrava, Czech Republic - 
Department Chair, IEEE Senior Member
- Drago Zagar, University of Osijek, Croatia - Dean, IEEE Senior Member

*Full Paper Submission*: March 13, 2018 (/extended deadline/)
*Notification of Paper Acceptance*: April 15, 2018
*Final Paper Submission*: April 30, 2018
*Authors' Early Registration and Payment*: May 10, 2018
*Authors' Late Registration and Payment*: May 20, 2018
*Listeners' Registration*: July 4, 2018
*Conference*: July 4-6, 2018

For more information please visit the Conference website at 
http://tsp.vutbr.cz/. We are also ready to answer your questions emailed 
to tsp at feec.vutbr.cz.

Looking forward to meeting you in Athens, Greece.

With best regards,

Norbert Herencsar and Costas Psychalinos
TSP 2018 General Co-Chairs

Web: http://tsp.vutbr.cz/
E-mail: tsp at feec.vutbr.cz

Follow us on:
- Facebook https://www.facebook.com/tspconf/
- Twitter https://twitter.com/tspconf/
doc. Ing. Norbert Herencsar, Ph.D., IEEE Senior Member - IEEE 
Czechoslovakia Section SP/CAS/COM Joint Chapter Chair
Department of Telecommunications
Faculty of Electrical Engineering and Communication
Brno University of Technology
Technicka 3082/12
616 00 Brno
Czech Republic


Prof. Dr. Costas Psychalinos, IEEE Senior Member
Physics Department
University of Patras
26504 Rio Patras

TSP Organizers reserve the right to exclude a paper from distribution 
after the Conference (e.g., non-indexing in IEEE Xplore® and other 
databases) if the paper is not presented at the Conference. However, 
this paper will be distributed as part of the Conference proceedings 
issued on an USB drive.